Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...
SAN DIEGO - Cohu Inc. (NASDAQ:COHU) announced Monday it received a multi-unit order for its Eclipse platform from a U.S.-based semiconductor manufacturer and foundry services company to support ...
Abstract: Both spatial and tempo-spectral information are essential for multi-channel speech enhancement, a field that has gained significant popularity in recent years. While many studies focus on ...
Abstract: In high-power applications, power modules with multi-paralleled chips have been widely used. The reliability of power electronic devices is intimately tied to thermal characteristics, making ...
Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules ...
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