Teams must also be able to review and interpret these results much faster to effectively guide engineering decisions within ...

PTC (NASDAQ: PTC) today announced a new robotics design-to-simulation workflow that connects PTC's cloud-native Onshape® computer-aided design (CAD) and product data management (PDM) platform with ...

Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Cambashi reviews the mechanical CAE and simulation market, highlighting AI innovation, major acquisitions, and growth ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Electronics design engineers spend substantial effort on schematics, simulation, and layout. Yet, a component’s long-term success also depends on how well its physical form aligns with downstream ...

Consider the inside of a typical wind turbine nacelle. It will contain a gearbox, electrical controls, a generator, hub mounting, blade controls, and several other major systems. In the case of ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Vinci today announced the ...