Figure 1. SimuReal simulation with heat mapping. Heat mapping is integrated into Coriolis Composites’ SimuReal software, correcting for IR camera incidence angle (IR camera seen at far top right) to ...
The main objective of the Clean Sky 2 (CS2) project FRAMES, which began in July 2020, is to validate a manufacturing approach being used to produce the Advanced Rear End Demonstrator manufactured by ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
The drive for miniaturization means that more heat is being generated in very restricted spaces inside electronic and electrical equipment. Accurate thermal simulation of system behaviour can ...
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